Role/Responsibilities:
This individual will work as part of a multi-disciplinary team and participate in the entire program life cycle from chip packaging/HW requirements and definition, substrate design and development, subsystem integration and testing, chip and platform validation, and characterization. The role involves:
- Driving chip substrate design.
- Building PCB HW designs for product as well as test infrastructure.
- Driving decisions on test strategies with collaboration between design, systems engineering and product development teams.
- Executing test plans ensuring complete coverage and traceability of feature/system requirements.
- Drive the development of automation and flows for chip validation and characterization.
Qualification/Required Skills:
- BS degree in Electrical Engineering or equivalent with 10+ years in PCB/HW design, validation, and characterization with at least 5 years of experience in leadership roles
- Experience leading validation engineering team to provide cross-functional technical leadership from product concept to mass production
- Experience building complex circuits from the chip packaging to PCB/module and sub-module design to complex cards and platforms.
- Experience in Component selection, BOM optimization and symbol/footprint creation
- Expertise in Electrical/mechanical board constraint definition and validation
- Proficient in a PCB design tools, preferably Cadence OrCAD
- Experience in PCB design strategies and techniques to meet strict EMI/EMC requirements
- Experience with Signal and Power Integrity analysis methods and tools
- Skilled at schematic capture, component/footprint creation, and board layout
- Experience with PCIe PCB implementation and other high speed serdes interfaces above 32GBps.
- Extensive experience in chip, HW and platform validation and characterization.
- Experience with lab management, people management, project management and test bench setup
- Experience coordinating and interacting with board manufacturing and assembly vendors