The person hired for this role will lead package design for high-performance chiplets and SOCs. They will be involved in all stages, from concept to high-volume manufacturing, and will be responsible for designing packaging solutions that meet industry leading power, performance, and cost targets. The work will be done alongside a group of highly experienced engineers across various domains of the AI/ML chip.
Locations:
Austin, TX | Santa Clara, CA
Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.